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A B glue filling machine MINI3030

Features:

1. Strong adaptability: silica gel, epoxy resin, PU glue

2. Optional automatic cleaning system

3. Lower limit detection of glue quantity

4. Without changing the gear pump (hardware), you can set parameters to adjust the glue output ratio

5. Standard dynamic double liquid valve


Applications:

Photovoltaic panels, craft gifts, COG sealants, SMT circuit boards, 3C, switch connectors, breakers, radiators, electronics, electrical appliances, window grilles, hanging tablets, RFID, power supplies,


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Project Details

ModelMINI 3030
Glue capacityA, B glue each 30KG
heating systemAdjustable constant temperature heating
Cleaning device system1ML capacity
mixing systemWith closed loop stepper motor
Two-component dispensing valvedynamic/non-dynamic
Maximum working frequency1800 rpm/S, 3600 times/H
input powerVoltage AC220 Power 1500W Frequency 50HZ
Working temperature5-40C
working environment humidity20-90%
Supply air pressureGreater than 0.5Mpa
Dimensions (W*D*H)1.9 mm *1.77 mm *1.68 mm
AB glue ratio1:1, 2:1, 3:1, 5:1, 10:1
Weight (KG)150KJ
quantitative systemGear pump/screw pump/volume metering


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