The led crystal bonding machine is controlled by a computer and is equipped with a CCD image sensing system. First, the CCD system scans to determine the correct path, and then enters the set programming program, and easily presses the button to realize the entire workflow. The led crystal bonding machine is widely used in the LED production industry. It is a high-precision and high-efficiency production equipment. Its accuracy lies in the use of a fully digitally controlled servo system for the crystal feeding Tabel, the crystal fetching swing arm and the silver paste system. and intelligent image recognition technology.

The LED die-bonding process belongs to an operation method of workpiece pick-and-place, that is, the LED chip is removed from the wafer plate through the suction nozzle, and then placed in the LED holder cup or on the PCB substrate. In order to fix the wafer, the process of dispensing glue is added. The introduction of machine vision can accurately locate the position where the wafer is picked up and the position where the wafer is to be placed and dispensed. The motion control moves the wafer directly under the nozzle based on the visual positioning feedback. In this solution, two sets of camera systems and two sets of XY platform motion control systems are used. One set of camera and motion systems completes the position positioning of the bracket or PCB, and the other set completes the position positioning of the LED chip.

LED die bonding machine can be positioned one by one or two points for diversified production, and one machine is suitable for all kinds of LED die bonding operations.